IO-Link Master Stack – certified software stack for IO-Link Masters
Anyone developing an IO-Link-enabled automation system, a PLC, or a field device with master functionality faces the task of fully implementing the bidirectional communication standard IO-Link™ (IEC 61131-9) — with all services prescribed by the current IO-Link specification: process data, ISDUs, events, data storage, and interleaved mode. The TEConcept IO-Link Master Stack handles this entire protocol layer as a ready-to-use, standard-compliant software component. Manufacturers of automation systems and mechanical engineers thus receive a proven foundation that runs on a variety of microcontrollers and IO-Link ASICs from leading semiconductor manufacturers — significantly accelerating the integration of IO-Link sensors and actuators into existing system environments. Instead of developing the protocol from scratch, your engineers can focus on what makes your system unique.
Would you like to test our IO-Link Master Stack?
IO-Link Master Stack Features
- Complies with the current IO-Link Interface Specification V1.1.5
- Multi-port support. The maximum number of ports is only resource-limited.
- Minimum Cycle Times:
- 0.4ms @ 230.4 kBaud
- 2.3ms @ 38.4 kBaud
- 18ms @ 4.8 kBaud
- Processor load max. 20MHz/port (COM3)
- Control and Test API
- IO-Link SMI API support according to v1.1.3 specification (extended Fieldnet mapping support with our TSTL API)
Implementation
The IO-Link Master Stack firmware provides full access to all features and services as defined in the IO-Link Interface Specification V1.1.2. This includes support for ISDUs, events, data storage, and interleaved mode. Please note:
- A real-time operating system is required. The real-time operating system is accessed via an abstraction layer, allowing support for multiple real-time operating systems. Currently, FREERTOS, OpenRTOS, EmBOS, and Keil RTX are supported.
Processors and ASICs supported by the IO-Link Master Stack
Our flexible stack structure allows easy porting to different platforms. If the desired processor or ASIC is not yet listed above, we are happy to perform a new porting. Please contact our support team for this.
Examples of existing MCUs
STMicroelectronics
- STM32F1, STM32F3, STM32F4 & STM32F7
- STM32G0
- STM32H7
- STM32L4
Renesas
- RA4M2
- RL78
- RX231
Other
Asix:
- AX58400
Silicon Labs:
- EFR32MG24
Examples of existing IO-Link ASICs:
STMicroelectronics
- L6360
Analog Devices
- LTC2874
- MAX14819
- MAX14824
Renesas
- CCE4510
- CCE4511
- ZIOL2401
Texas Instruments
- TIOL112
Compilers / Development Environments supported by the IO-Link Master Stack
- KEIL-MDK
- IAR Toolchain
- Eclipse/GNU-GCC Toolchain / NXP LPCXpresso
License Information for the IO-Link Master Stack and Scope of Delivery
- Development license, including the complete source code
- Production license
- Porting to target hardware
- Documentation, installation manual, and porting description
- API interface documentation
- Example application
- Compiler & Linker example setup
- IO-Link configuration software with IODD interpreter for commissioning tests
Please contact our sales department for further details on licensing, the scope of delivery, and practical project implementation.
Additional offers for the IO-Link Master Stack
- Development Platforms
- Software/hardware development support
- Execution of conformity tests
- Provision of diagnostic & test equipment (Master Tester & EMC Test Device)
Control Tool Software
A Control Tool (CT) software for controlling the stack via a PC facilitates the integration of the stack into the customer application and offers simple testing and comparison options for stack functionality.
SMI-based Master Bootloader
The TEConcept IO-Link Bootloader enables secure firmware updates via SMI services in boot mode – with handshake protocol, CRC protection, and support for multiple firmware variants.
Serial Transport Layer (TSTL)
The TEConcept Serial Transport Layer (TSTL) connects an IO-Link Stack Controller fault-tolerantly to a host system and transmits SMI services from multiple ports simultaneously via SPI, UART, or Ethernet.
SMIT Serial Transport Layer Library
SMIT is a lean communication protocol for asynchronous transmission of SMI services via UART or USB – with CRC integrity checking and automatic retransmission in case of errors.
SMI Test Communication Server
The TEConcept SMI Test Communication Server (STCS) connects TCP clients to an IO-Link Master via TSTL or SMIT and runs as an executable program on Windows and Linux.
IO-Link USB-C Master, IO-Link Master Module, or IO-Link Master Stack?
All three solutions offer IO-Link Master functionality — but differ fundamentally in their application scenarios.
The USB-C Master is designed for PC-based use in development and service: it is powered directly via USB-C, requires no external power supply, and comes with a complete Windows GUI. The IO-Link Master Module, on the other hand, is a compact PCB unit for direct integration into your own hardware — it communicates with the host system via SPI or UART and is designed for OEM use in series production. The IO-Link Master Stack goes a step further: it is not hardware, but a licensable software component that integrates IO-Link Master functionality directly into your own host platform — for example, into a gateway, a PLC, or an embedded system. This allows for maximum flexibility in hardware selection but requires corresponding development resources for integration.
For development, testing, and service in the lab or field, the USB-C Master is the right choice. If a product goes into series production, depending on the approach, the Master Module as a ready-made hardware component or the Master Stack as a software integration are suitable.
1-Port USB-C Master
The IO-Link 1-Port USB-C Master is the compact development and service tool for engineers who want to parameterize, analyze, and test IO-Link sensors and actuators directly from a PC — without a PLC, without an external power supply. Connected via USB-C, it provides a complete master connection and offers immediate access to process data, parameters, and device events via the included Windows GUI (Control Tool).
1-Port Master Module
On a minimal footprint of only 43 mm x 33 mm, this module offers an integrated transceiver and a full V1.1.4 Master Stack. Communication with your hardware is straightforward via simple telegrams via SPI or UART interfaces. An integrated USB port for the TEConcept Control Tool is also available for easy offline configuration.
4-Port Master Module
For more comprehensive requirements, this module provides four fully tested, IO-Link compliant ports on 59 mm x 39 mm. It allows direct access to process data and diagnostic information from up to four devices simultaneously. Optionally, we offer customized application software adaptations for this module to realize cost-effective stand-alone systems in the sense of a mini-PLC.
Contact
- +49 761 21443640
- +49 761 21443636
- info@teconcept.de